Application Cases
THROUGH VIA FILLING FOR ADVANCED PACKAGING
—
Technical specifications：
Substrate：Silicon/Glass/Ceramics
Via：Depth/Diameter>20um
Via Type：Through hole/Blind hole
Need CMP: Yes
Alloy material： Zn-Al /Melting point 380 ℃/conductivity 6.5µΩ.cm(~25%of Cu)
Process temperature：~425 ℃
Previous
Next
MEMS SOLENOIDS WITH MAGNETIC CAVITY
—
μCasting ™ solenoid coil is fabricated by silicon bulk etching and MEMS-Casting technology. µCasting ™ solenoid is considered as the next generation chip-type solenoid.
Technical specifications：
Turn number：5~200
Line width：>20 μm
Line spacing:>20 μm
Data Download ：µCasting™ solenoid coil manual
Previous
Next
RF DEVICE
—
Previous
Next
Fanout
—
MEMS-Casting technology for manufacturing of complex 3D fanout structure
Previous
Next